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Problems
Solder joint dimensions in SMD quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. Voiding is a fault commonly associated with solder joints, especially when reflowing a solder paste in the SMD application. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.
SMD is unsuitable for large, high-power, or high-voltage parts, for example in power circuitry. It is common to combine SMD and through-hole construction, with transformers, heat-sinked power semiconductors, physically large capacitors, fuses, connectors, and so on mounted on one side of the PCB through holes.
SMD is unsuitable as the sole attachment method for components that are subject to frequent mechanical stress, such as connectors that are used to interface with external devices that are frequently attached and detached.
SMD are small low wattage components so cannot duplicate proper through hole component. There were developed for computers, not for audio products.
They have very small and weak solder joints compared with through hole and are not recommended where there is physical shock or vibration, which is what a switch does when you turn it. This has given the DACT switch a reputation for losing positions from broken joints. They are not reliable.
Not my experience at all. Mine, over many years of using them, is the complete opposite.